Plasma System for High-Throughput, Inline Boat Processing The patented plasma module provides exceptional uniformity and run-to-run process repeatability. Its advanced three axis symmetrical plasma chamber ensures control over all process parameters and highly repeatable results.
The system seamlessly integrates into a production line, while accommodating a wide range of boat sizes, yielding unmatched production flexibility. Its compact plasma chamber and proprietary process control system minimize cycle time.
The integrated boat handler of the FlexTRAK-2MB plasma system provides rapid material transfer, up to 2 boats per plasma cycle. Combined with the compact design and short plasma cycle, the system maximizes through-put and minimizes cost of ownership.
Applications Plasma processes for pre-flip chip underfill, pre-die attach, pre-wire bond and pre-mold steps.
Plasma Contamination Removal & Cleaning
Fluorine & other halogens
Metals & metal oxides
Roughen surfaces to improve adhesion and reduced delamination
Modify surfaces to increase bond strength and surface tension properties
Improve flip chip underfill performance by minimizing voids, enhancing adhesion, increasing wicking speed and maximizing filet height uniformity
Improve mold material flow to eliminate voids and reduce wire sweep
Features and Benefits
Unique boat bypass feature optimizes productivity
Multiple inline plasma modules increase throughput
High uniform plasma treatment
Production ready dual lane boat handling
Ideal for pre-Flip-Chip Underfill (FCUF) processes